5B37-E-04

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system.It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.

The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack).8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.

Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions.The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs.Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA).Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal.All modules feature a universal pinout and may be readily “mixed and matched” and interchanged without disrupting field wiring.

Each backplane contains the provision for a subsystem power supply.The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power.Two LEDs are used to indicate that power is being applied.

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