CL31B474KACWPNC

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CL31B474KACWPNC with pin details, that includes CL Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 1206 (3216 Metric), that offers Capacitance features such as 0.47μF, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Surface Mount, MLCC Mounting Type, the device can also be used as Open Mode, Soft Termination Features. In addition, the Voltage Rated is 25V, the device is offered in 0.126" L x 0.063" W (3.20mm x 1.60mm) Size Dimension, the device has a Automotive, Boardflex Sensitive of Applications, and Tolerance is ±10%, and the Temperature Coefficient is X7R, and Ratings is AEC-Q200, and the Thickness Max is 0.039" (1.00mm).

CL31B473MCCNNWC with user guide, that includes 100V Voltage Rated, they are designed to operate with a ±20% Tolerance, Thickness Max is shown on datasheet note for use in a 0.039" (1.00mm), that offers Temperature Coefficient features such as X7R, Size Dimension is designed to work in 0.126" L x 0.063" W (3.20mm x 1.60mm), as well as the CL Series, the device can also be used as Digi-ReelR Alternate Packaging Packaging. In addition, the Package Case is 1206 (3216 Metric), it has an Operating Temperature range of -55°C ~ 125°C, the device has a Surface Mount, MLCC of Mounting Type, and Capacitance is 0.047μF, and the Applications is General Purpose.

CL31B474JBFNNNE with circuit diagram manufactured by SAMSUNG. The CL31B474JBFNNNE is available in SMD Package, is part of the IC Chips.