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The XCV812E-8BG560C is IC FPGA 404 I/O 560MBGA, that includes VirtexR-E EM Series, they are designed to operate with a 560-LBGA, Metal Package Case, it has an Operating Temperature range of 0°C ~ 85°C (TJ), that offers Mounting Type features such as Surface Mount, Voltage Supply is designed to work in 1.71 V ~ 1.89 V, as well as the 560-MBGA (42.5x42.5) Supplier Device Package, the device can also be used as 254016 Number of Gates. In addition, the Number of I O is 404, the device is offered in 4704 Number of LABs CLBs, the device has a 21168 of Number of Logic Elements Cells, and Total RAM Bits is 1146880.
The XCV812E-7FG900C is IC FPGA 556 I/O 900FBGA, that includes 1.71 V ~ 1.89 V Voltage Supply, they are designed to operate with a 1146880 Total RAM Bits, Supplier Device Package is shown on datasheet note for use in a 900-FBGA (31x31), that offers Series features such as VirtexR-E EM, Package Case is designed to work in 900-BBGA, it has an Operating Temperature range of 0°C ~ 85°C (TJ), the device can also be used as 21168 Number of Logic Elements Cells. In addition, the Number of LABs CLBs is 4704, the device is offered in 556 Number of I O, the device has a 254016 of Number of Gates, and Mounting Type is Surface Mount.
The XCV812E-8FG900C is IC FPGA 556 I/O 900FBGA, that includes Surface Mount Mounting Type, they are designed to operate with a 254016 Number of Gates, Number of I O is shown on datasheet note for use in a 556, that offers Number of LABs CLBs features such as 4704, Number of Logic Elements Cells is designed to work in 21168, it has an Operating Temperature range of 0°C ~ 85°C (TJ), the device can also be used as 900-BBGA Package Case. In addition, the Series is VirtexR-E EM, the device is offered in 900-FBGA (31x31) Supplier Device Package, the device has a 1146880 of Total RAM Bits, and Voltage Supply is 1.71 V ~ 1.89 V.
XCV8615B with EDA / CAD Models manufactured by ON. The XCV8615B is available in QFN-20 Package, is part of the IC Chips.