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SZC has defined a complete process of the technical management of the supply chain, from the supplier selection and monitoring all the way, through to the inspections and testing techniques aimed to prevent counterfeit components entering the manufacturing line .LEARN MORE
SZC's inspectors meticulously use an digital microscope to verify the typing, year and country of origin of the components.
They also check for any re-polishing traces on the surface coating, the condition of the pins, and the manufacturer's logo to ensure the authenticity of the parts.
Visual Inspection Capabilities
SZC's non-destructive and color differentiation available microscopes can detect blacktopping, sanding, oxidation, and re-tinning.
SZC offers inspection systems that recognize 2D characters and ensure that a feature is positioned correctly or in the required dimension.
Regardless of the components, we develop the optimal inspection solution for each customer. We provide flexibility through freely configurable infeed, outfeed, and item classifications.
Non-destructive testing includes an array of inspection techniques that allow inspectors to collect data about a material without damaging it.
These methods are used to detect defects, identify imperfections, the locations of defects or imperfections on the surface of material created.
Nondestructive Testing Capabilities
We use X-ray scanning to identify any internal defects in products. This helps us determine if there are any irregularities such as voids, cracks or other structural abnormalities within the component.
SZC's XRF machine is a non-destructive analytical technique that can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays.
C-SAM acoustic microscopy techniques analyze the intensity and phase of both the reflected and transmitted waves, thereby disclosing internal flaws and defects such as delamination and voids.
We perform a failure analysis to determine precisely why an electronic component integrated into a circuit may not operate properly.
Destructive testing is generally conducted before a component enters mass production, such as decapsulation and lead solderability, in order to find the exact point of failure of materials, components, or machines.
Destructive Testing Capabilities
Decapsulation is used to check its size, the manufacturer's logo, the copyright year, and the wafer code.
Through this process, any resurfacing or remarking should have been removed to expose the sanded or possibly original factory surface of the component.
We are able to confirm lead integrity of older components using our X-Tronic soldering station or temperature-regulated soldering pot.
SZC measures bond strengths and distributions to determine whether the bonds meet the required strength standards.
SZC offers customized authenticity testing services to match our client's unique needs, and we are always delighted to provide further information upon request. Get in touch with us today to learn more about SZC's authenticity-testing services.VIEW ALL
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