Texas Instruments (TI) has chosen Lehi, Utah, as the site for its upcoming 300-millimeter semiconductor wafer fabrication plant (fab). This new fab, adjacent to TI's existing 300-mm semiconductor wafer fab, LFAB, will consolidate into a single fab upon completion.
Haviv Ilan, TI's Executive Vice President and COO, expressed that the decision aligns with their long-term manufacturing roadmap, anticipating the semiconductor growth in electronics, especially in industrial and automotive sectors. The $11 billion investment, the largest in Utah's history, will generate about 800 direct and numerous indirect jobs, emphasizing TI's commitment to Utah. Governor Spencer Cox highlighted that TI's investment will establish Utah as a global semiconductor hub.
The Lehi location, chosen for its skilled talent, robust infrastructure, and community support, will produce millions of analog and embedded processing chips daily. The fab aims for LEED Gold certification, emphasizing structural efficiency and sustainability, with plans for water recycling exceeding current rates. Construction starts in H2 2023, with production anticipated in 2026, contributing to TI's capital spending plan for expanding manufacturing capacity and complementing existing fabs in Texas.
