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MT4HTF3264AY-53ED3 Micron Technology Inc.
Micron Technology Inc.
Micron pioneers inventive solutions driving tech breakthroughs like AI, IoT, self-driving cars, and space exploration. Innovating data management revolutionizes global progress. Over 40 years, 40,000 patents contributed. A diverse team of 34,000 spans 18 nations, fostering inclusive brilliance.
View All Product from Micron Technology Inc.Table 2: AddressingParameterRefresh countRow addressDevice bank addressDevice configurationColumn addressModule rank address128MB8K8K A[12:0]4 BA[1:0]256MB8K8K A[12:0]4 BA[1:0]512MB8K8K A[12:0]8 BA[2:0]256Mb (16 Meg x 16)512Mb (32 Meg x 16)1Gb (64 Meg x 16)512 A[8:0]1 S0#1K A[9:0]1 S0#1K A[9:0]1 S0#Table 3: Part Numbers and Timing Parameters – 128MB Modules (End of Life)Base device: MT47H16M16,1 256Mb DDR2 SDRAMPart Number2MT4HTF1664A(I)Y-667__MT4HTF1664A(I)Y-53E__MT4HTF1664A(I)Y-40E__ModuleDensity128MB128MB128MBConfiguration16 Meg x 6416 Meg x 6416 Meg x 64ModuleBandwidthMemory Clock/Data RateClock Cycles(CL-tRCD-tRP)5.3 GB/s4.3 GB/s3.2 GB/s3.0ns/667 MT/s3.75ns/533 MT/s5.0ns/400 MT/s5-5-54-4-43-3-3Table 4: Part Numbers and Timing Parameters – 256MB ModulesBase device: MT47H32M16,1 512Mb DDR2 SDRAMPart Number2MT4HTF3264A(I)Y-80E__MT4HTF3264A(I)Y-800__MT4HTF3264A(I)Y-667__MT4HTF3264A(I)Y-53E__MT4HTF3264A(I)Y-40E__ModuleDensity256MB256MB256MB256MB256MBConfigurationModuleBandwidthMemory Clock/Data RateClock Cycles(CL-tRCD-tRP)32 Meg x 6432 Meg x 6432 Meg x 6432 Meg x 6432 Meg x 646.4 GB/s6.4 GB/s5.3 GB/s4.3 GB/s3.2 GB/s2.5ns/800 MT/s2.5ns/800 MT/s3.0ns/667 MT/s3.75ns/533 MT/s5.0ns/400 MT/s5-5-56-6-65-5-54-4-43-3-3Table 5: Part Numbers and Timing Parameters – 512MB ModulesBase device: MT47H64M16,1 1Gb DDR2 SDRAMPart Number2MT4HTF6464A(I)Y-80E__MT4HTF6464A(I)Y-800__MT4HTF6464A(I)Y-667__MT4HTF6464A(I)Y-53E__MT4HTF6464A(I)Y-40E__ModuleDensity512MB512MB512MB512MB512MBConfigurationModuleBandwidthMemory Clock/Data RateClock Cycles(CL-tRCD-tRP)64 Meg x 6464 Meg x 6464 Meg x 6464 Meg x 6464 Meg x 646.4 GB/s6.4 GB/s5.3 GB/s4.3 GB/s3.2 GB/s2.5ns/800 MT/s2.5ns/800 MT/s3.0ns/667 MT/s3.75ns/533 MT/s5.0ns/400 MT/s5-5-56-6-65-5-54-4-43-3-3Notes:1. The data sheet for the base device can be found on Micron’s Web site.2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.Consult factory for current revision codes. Example: MT4HTF3264AY-667E1.PDF: 09005aef80ed6fdahtf4c16_32_64x64ay – Rev. H 3/10 EN2Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2003 Micron Technology, Inc. All rights reserved.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Series | - | |
Product Status | Obsolete | |
Memory Type | DDR2 SDRAM | |
Memory Size | 256MB | |
Package | Tray | |
Transfer Rate (Mb/s, MT/s, MHz) | 533 | |
Package / Case | 240-UDIMM |
Micron Technology Inc.
Micron pioneers inventive solutions driving tech breakthroughs like AI, IoT, self-driving cars, and space exploration. Innovating data management revolutionizes global progress. Over 40 years, 40,000 patents contributed. A diverse team of 34,000 spans 18 nations, fostering inclusive brilliance.
View All Product from Micron Technology Inc.MODULE DDR3L SDRAM 8GB 204SODIMM
MODULE DDR4 SDRAM 32GB 260SODIMM
MODULE DDR SDRAM 256MB 200SODIMM
MODULE DDR SDRAM 64MB 200SODIMM
MODULE DDR4 SDRAM 64GB 288RDIMM
MODULE DDR3L SDRAM 4GB 204SODIMM
MODULE DDR SDRAM 128MB 200SODIMM
MODULE DDR2 SDRAM 256MB 240RDIMM
MODULE DDR2 SDRAM 1GB 240RDIMM
MODULE DDR4 SDRAM 32GB 288RDIMM