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M2S060TS-FG676 Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
View All Product from Microsemi CorporationThe M2S060TS-FG676 parts manufactured by Microsemi Corporation are available for purchase at szcomponents electronic components distributor. Here you can find various types and values of electronic parts from the world's leading manufacturers. The M2S060TS-FG676 is parts of the System On Chip (SoC) in Active It has an Operating Temperature range of 0°C ~ 85°C (TJ). The M2S060TS-FG676 provides a 676-BGA package/case. It is designed for surface mount applications in a 676-FBGA (27x27) package. The production status marked on szcomponents.com is for reference only. If you didn't find what you were looking for, you can get more valuable information by emails, such as the M2S060TS-FG676 Inventory quantity, preferential price, datasheet, and manufacturer. We are always happy to hear from you, so feel free to contact us.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Core Processor | ARM® Cortex®-M3 | |
Flash Size | 256KB | |
RAM Size | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 60K Logic Modules | |
Series | SmartFusion®2 | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package | Tray | |
Package / Case | 676-BGA | |
Product Status | Active | |
Supplier Device Package | 676-FBGA (27x27) | |
Architecture | MCU, FPGA |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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