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HCTL-1100#PLC Broadcom Limited
Broadcom Limited
Broadcom stands as a multifaceted worldwide pioneer in semiconductors, forged over five decades of ingenuity, cooperation, and engineering eminence. Its broad-ranging collection of products caters to diverse applications in four pivotal end sectors: wired infrastructure, wireless communications, enterprise storage, and industrial realms. Our products find purpose across domains such as data center networks, residential interconnectivity, telecommunications gear, and renewable energy systems, spanning data servers, automation, and displays.
View All Product from Broadcom LimitedHey there! If you're on the hunt for some Broadcom Limited parts like the HCTL-1100#PLC, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the HCTL-1100#PLC, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The 10018783-10213TLF is CONN PCI EXPRESS 164POS VERT PCB, that includes Black Color, they are designed to operate with a HPCE? Series, Product is shown on datasheet note for use in a PCI Express, that offers Packaging features such as Tray, Mounting Style is designed to work in Through Hole, as well as the 1.1 A Current Rating, the device can also be used as Solder Termination Style. In addition, the Voltage Rating is 300 VAC, the device is offered in Solder, Staggered Termination, it has an Operating Temperature range of -55°C ~ 85°C, and Mounting Type is Through Hole, and the Features is Board Guide, Locking Ramp, and Contact Material is Copper Alloy, and the Contact Finish is Gold, and Contact Finish Thickness is Flash, and the Number of Positions is 164, and Pitch is 0.039" (1.00mm), and the Number of Rows is 2, and Gender is Female, and the Contact Type is Cantilever, and Card Thickness is 0.062" (1.57mm), and the Card Type is PCI Express?, and Housing Material is Nylon, and the Board Thickness is 2.36 mm, and Contact Plating is Gold, and the Insulation Resistance is 1000 MOhms, and Mounting Angle is Vertical.
The 10018783-10212TLF is CONN PCI EXPRESS 98POS VERT PCB, that includes 300 VAC Voltage Rating, they are designed to operate with a Solder Termination Style, Termination is shown on datasheet note for use in a Solder, Staggered, that offers Series features such as HPCE?, Product is designed to work in PCI Express, as well as the 0.039" (1.00mm) Pitch, the device can also be used as Tray Packaging, it has an Operating Temperature range of -55°C ~ 85°C, the device is offered in 2 Number of Rows, the device has a 98 of Number of Positions, and Mounting Style is Through Hole, and the Mounting Angle is Vertical, and Mounting Type is Through Hole, and the Insulation Resistance is 1000 MOhms, and Housing Material is Nylon, and the Gender is Female, and Features is Board Guide, Locking Ramp, and the Current Rating is 1.1 A, and Contact Type is Cantilever, and the Contact Plating is Gold, and Contact Material is Copper Alloy, and the Contact Finish Thickness is Flash, and Contact Finish is Gold, and the Color is Black, and Card Type is PCI Express?, and the Card Thickness is 0.062" (1.57mm), and Board Thickness is 2.36 mm.
10018783-10220TLF with circuit diagram, that includes Tray Packaging.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Package | Tube | |
Mounting Type | Surface Mount | |
Supplier Device Package | 44-PLCC | |
Package / Case | 44-LCC (J-Lead) | |
Voltage - Supply | 4.75V ~ 5.25V | |
Interface | TTL | |
Applications | DC Motor Controller | |
Product Status | Obsolete |
Broadcom Limited
Broadcom stands as a multifaceted worldwide pioneer in semiconductors, forged over five decades of ingenuity, cooperation, and engineering eminence. Its broad-ranging collection of products caters to diverse applications in four pivotal end sectors: wired infrastructure, wireless communications, enterprise storage, and industrial realms. Our products find purpose across domains such as data center networks, residential interconnectivity, telecommunications gear, and renewable energy systems, spanning data servers, automation, and displays.
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