AGID019R31B1E2V datasheet
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AGID019R31B1E2V Intel
Intel
Intel empowers electronic system designers for swift, economical innovation, distinctiveness, and triumph in their sectors. Intel proffers FPGAs, SoCs, CPLDs, and Power Solutions, delivering elevated-value resolutions globally.
View All Product from IntelHey there! If you're on the hunt for some Intel parts like the AGID019R31B1E2V, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the AGID019R31B1E2V, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The MM70-314-310B1-1-R300 is MEM SOCKET 314POS RT ANG GOLD, that includes Black Color, they are designed to operate with a MM70 Series, Product is shown on datasheet note for use in a PCI Express, that offers Packaging features such as Cut Tape (CT) Alternate Packaging, Mounting Style is designed to work in SMD/SMT, as well as the Solder Termination, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Mounting Type is Surface Mount, Right Angle, the device is offered in Board Guide, Latches Features, the device has a Copper Alloy of Contact Material, and Contact Finish is Gold, and the Contact Finish Thickness is 3.9μin (0.10μm), and Number of Positions is 314, and the Pitch is 0.020" (0.50mm), and Number of Rows is 2, and the Gender is Female, and Card Thickness is 0.047" (1.20mm), and the Card Type is MXM 3.0, and Mounting Angle is Right.
The MM70-314-310B1-2-R300 is MEM SOCKET 314POS RT ANG GOLD, that includes Solder Termination, they are designed to operate with a MM70 Series, Product is shown on datasheet note for use in a PCI Express, that offers Pitch features such as 0.020" (0.50mm), Packaging is designed to work in Tape & Reel (TR), it has an Operating Temperature range of -40°C ~ 80°C, the device can also be used as 2 Number of Rows. In addition, the Number of Positions Bay Row is , the device is offered in 314 Number of Positions, the device has a SMD/SMT of Mounting Style, and Mounting Angle is Right, and the Mounting Type is Surface Mount, Right Angle, and Gender is Female, and the Contact Material is Copper Alloy, and Contact Finish Thickness is 12μin (0.30μm), and the Contact Finish is Gold, and Color is Black, and the Card Type is MXM 3.0, and Card Thickness is 0.047" (1.20mm).
MM70-314-310B1-1-T30 with circuit diagram, that includes 0.047" (1.20mm) Card Thickness, they are designed to operate with a MXM 3.0 Card Type, Color is shown on datasheet note for use in a Black, that offers Contact Finish features such as Gold, Contact Finish Thickness is designed to work in 12μin (0.30μm), as well as the Copper Alloy Contact Material, the device can also be used as Female Gender. In addition, the Mounting Type is Surface Mount, Right Angle, the device is offered in 314 Number of Positions, the device has a of Number of Positions Bay Row, and Number of Rows is 2, it has an Operating Temperature range of -40°C ~ 80°C, and Packaging is Bulk, and the Pitch is 0.020" (0.50mm), and Series is MM70, and the Termination is Solder.
MM701V with EDA / CAD Models manufactured by MITSUMI. The MM701V is available in SOP-8 Package, is part of the IC Chips.
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A: Our professional business development department conducts rigorous testing and verification of the qualifications of original manufacturers and agents of . All suppliers must undergo and pass our qualification review before they are allowed to list their AGID019R31B1E2V devices on our platform. We prioritize the sourcing channels and quality of AGID019R31B1E2V products above everything else, ensuring thorough supplier audits so you can make your purchase with utmost confidence.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Series | Agilex I | |
Package | Tray | |
Product Status | Active | |
Architecture | MPU, FPGA | |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
RAM Size | 256KB | |
Peripherals | DMA, WDT | |
Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Speed | 1.4GHz | |
Primary Attributes | FPGA - 1.9M Logic Elements | |
Operating Temperature | 0°C ~ 100°C (TJ) | |
Package / Case | 3184-BFBGA Exposed Pad | |
Supplier Device Package | 3184-BGA (56x45) |
Intel
Intel empowers electronic system designers for swift, economical innovation, distinctiveness, and triumph in their sectors. Intel proffers FPGAs, SoCs, CPLDs, and Power Solutions, delivering elevated-value resolutions globally.
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