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1N5238B (DO-35) Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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The 1N5238B is DIODE ZENER 8.7V 500MW DO35, that includes Bulk Packaging, they are designed to operate with a (DO-35) Part Aliases, Unit Weight is shown on datasheet note for use in a 0.004445 oz, that offers Mounting Style features such as Through Hole, Height is designed to work in 1.91 mm, as well as the 4.56 mm Length, the device can also be used as 1.91 mm Width. In addition, the Package Case is DO-204AH, DO-35, Axial, it has an Operating Temperature range of -65°C ~ 200°C, the device has a Through Hole of Mounting Type, and Supplier Device Package is DO-35, and the Configuration is Single, and Tolerance is ±5%, and the Power Max is 500mW, and Voltage Zener Nom Vz is 8.7V, and the Impedance Max Zzt is 8 Ohm, and Current Reverse Leakage Vr is 3μA @ 6.5V, and the Voltage Forward Vf Max If is 1.2V @ 200mA, and Pd Power Dissipation is 500 mW, it has an Maximum Operating Temperature range of + 200 C, it has an Minimum Operating Temperature range of - 65 C, and the Vz Zener Voltage is 8.7 V, and Voltage Tolerance is 5 %, and the Voltage Temperature Coefficient is 0.065 %/C, and Zener Current is 20 mA, and the Zz Zener Impedance is 8 Ohms, and Ir Reverse Current is 3 uA.
1N5238B TR with user guide, that includes 8.7V Voltage Zener Nom Vz, they are designed to operate with a 1.1V @ 200mA Voltage Forward Vf Max If, Tolerance is shown on datasheet note for use in a ±5%, that offers Supplier Device Package features such as DO-35, Series is designed to work in 1N5238, as well as the 500mW Power Max, the device can also be used as Cut Tape (CT) Alternate Packaging Packaging. In addition, the Package Case is DO-204AH, DO-35, Axial, it has an Operating Temperature range of -65°C ~ 200°C, the device has a Through Hole of Mounting Type, and Impedance Max Zzt is 8 Ohm, and the Current Reverse Leakage Vr is 3μA @ 6.5V.
1N5238B BK with circuit diagram, that includes 3μA @ 6.5V Current Reverse Leakage Vr, they are designed to operate with a 8 Ohm Impedance Max Zzt, Mounting Type is shown on datasheet note for use in a Through Hole, it has an Operating Temperature range of -65°C ~ 200°C, Package Case is designed to work in DO-204AH, DO-35, Axial, as well as the Bulk Alternate Packaging Packaging, the device can also be used as 500mW Power Max. In addition, the Series is 1N523, the device is offered in DO-35 Supplier Device Package, the device has a ±5% of Tolerance, and Voltage Forward Vf Max If is 1.1V @ 200mA, and the Voltage Zener Nom Vz is 8.7V.
1N5238B (DO-35) with EDA / CAD Models, that includes Through Hole Mounting Type, they are designed to operate with a DO-35 Supplier Device Package, Package Case is shown on datasheet note for use in a DO-204AH, DO-35, Axial, that offers Packaging features such as Bulk, Voltage Zener Nom Vz is designed to work in 8.7V, as well as the 8 Ohm Impedance Max Zzt, it has an Operating Temperature range of -65°C ~ 175°C. In addition, the Power Max is 500mW, the device is offered in 3μA @ 6.5V Current Reverse Leakage Vr, the device has a 1.5V @ 200mA of Voltage Forward Vf Max If, and Tolerance is ±5%.
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1N5236BZENER DIODE, 7.5V, 5%, 0.5W, UNI | 0.03 |
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TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | DO-204AH, DO-35, Axial | |
Mounting Type | Through Hole | |
Operating Temperature | -65°C ~ 175°C | |
Voltage - Forward (Vf) (Max) @ If | 1.5 V @ 200 mA | |
Current - Reverse Leakage @ Vr | 3 µA @ 6.5 V | |
Impedance (Max) (Zzt) | 8 Ohms | |
Power - Max | 500 mW | |
Tolerance | ±5% | |
Voltage - Zener (Nom) (Vz) | 8.7 V | |
Supplier Device Package | DO-35 | |
Package | Bulk | |
Product Status | Active |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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