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HSM350GE3/TR13 Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
View All Product from Microsemi CorporationHey there! If you're on the hunt for some Microsemi Corporation parts like the HSM350GE3/TR13, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the HSM350GE3/TR13, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | DO-215AB, SMC Gull Wing | |
Mounting Type | Surface Mount | |
Current - Reverse Leakage @ Vr | 100 µA @ 50 V | |
Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
Voltage - Forward (Vf) (Max) @ If | 620 mV @ 3 A | |
Current - Average Rectified (Io) | 3A | |
Voltage - DC Reverse (Vr) (Max) | 50 V | |
Technology | Schottky | |
Operating Temperature - Junction | -55°C ~ 175°C | |
Supplier Device Package | DO-215AB | |
Package | Tape & Reel (TR) | |
Product Status | Active |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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