XC2C512-10FGG324I datasheet
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XC2C512-10FGG324I AMD
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
View All Product from AMDThe CoolRunner-II 512-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and high speed to battery operated devices. Due to the low power stand-by and dynamic operation, overall system reliability is improved This device consists of thirty two Function Blocks inter-connected by a low power Advanced Interconnect Matrix (AIM). The AIM feeds 40 true and complement inputs to each Function Block. The Function Blocks consist of a 40 by 56 P-term PLA and 16 macrocells which contain numerous configuration bits that allow for combinational or registered modes of operation. Additionally, these registers can be globally reset or preset and configured as a D or T flip-flop or as a D latch. There are also multiple clock signals, both global and local product term types, configured on a per macrocell basis. Output pin configurations include slew rate limit, bus hold, pull-up, open drain and programmable grounds.
A Schmitt-trigger input is available on a per input pin basis. In addition to storing macrocell output states, the macrocell registers may be configured as "direct input" registers to store signals directly from input pins. Clocking is available on a global or Function Block basis. Three global clocks are available for all Function Blocks as a synchronous clock source. Macrocell registers can be individually configured to power up to the zero or one state. A global set/reset control line is also available to asynchronously set or reset selected registers during operation. Additional local clock, synchronous clock-enable, asynchronous set/reset and output enable signals can be formed using product terms on a per-macrocell or per-Function Block basis. A DualEDGE flip-flop feature is also available on a per macrocell basis. This feature allows high performance synchronous operation based on lower frequency clocking to help reduce the total power consumption of the device. Circuitry has also been included to divide one externally supplied global clock (GCK2) by eight different selections. This yields divide by even and odd clock frequencies.
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XC2C512-10FG324IIC CPLD 512MC 9.2NS 324FBGA | 55.32 |
450
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XC2C384-10TQ144IIC CPLD 384MC 9.2NS 100TQFP | 221.28 |
250
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IC CPLD 384MC 7.1NS 100TQFP
IC CPLD 384MC 7.1NS 256FTBGA
IC CPLD 384MC 7.1NS 256FTBGA
IC CPLD 512MC 9.2NS 324FBGA
IC CPLD 384MC 9.2NS 100TQFP
IC CPLD 384MC 7.1NS 208QFP
TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | 324-BBGA | |
Programmable | Not Verified | |
Supplier Device Package | 324-FBGA (23x23) | |
Programmable Type | In System Programmable | |
Delay Time tpd(1) Max | 9.2 ns | |
Voltage Supply - Internal | 1.7V ~ 1.9V | |
Number of Logic Elements/Blocks | 32 | |
Number of Macrocells | 512 | |
Number of Gates | 12000 | |
Number of I/O | 270 | |
Series | CoolRunner II | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Package | Tray | |
Mounting Type | Surface Mount | |
Product Status | Active |
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
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