XCR3384XL-10FG324I

XCR3384XL-10FG324I

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XCR3384XL-10FG324I
IC CPLD 384MC 9NS 324FBGA
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Price negotiable

Price update:a months ago
Available in stock: 2481
45
Serves customers in 45 countries
1000+
Worldwide Manufacturers
$140M
$140M Growth in 5 Years
50.0M+
50M Parts Shipped in 5 Years
AMD

AMD

AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).

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XCR3384XL-10FG324I Products

The CoolRunner XPLA3 (eXtended Programmable Logic Array) family of CPLDs is targeted for low power systems that include portable, handheld, and power sensitive applications. Each member of the CoolRunner XPLA3 family includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the CoolRunner XPLA3 family offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for "turbo bits" or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. CoolRunner devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.

The CoolRunner XPLA3 family employs a full PLA structure for logic allocation within a function block. The PLA provides maximum flexibility and logic density, with superior pin locking capability, while maintaining deterministic timing.

CoolRunner XPLA3 CPLDs are supported by Xilinx® WebPACK™ software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.

The CoolRunner XPLA3 family features also include the industry-standard, IEEE 1149.1, JTAG interface through which boundary-scan testing, In-System Programming (ISP), and reprogramming of the device can occur. The CoolRunner XPLA3 CPLD is electrically reprogrammable using industry standard device programmers.

Feature

  • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
    • Typical Standby Current of 17 to 18 μA at 25°C
  • Innovative CoolRunner™ XPLA3 architecture combines high speed with extreme flexibility
  • Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
  • Advanced 0.35μ five layer metal EEPROM process
    • 1,000 erase/program cycles guaranteed
    • 20 years data retention guaranteed
  • 3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
    • Full Boundary-Scan Test (IEEE 1149.1)
    • Fast programming times
  • Support for complex asynchronous clocking
    • 16 product term clocks and four local control term clocks per function block
    • Four global clocks and one universal control term clock per device
  • Excellent pin retention during design changes
  • Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
  • 5V tolerant I/O pins
  • Input register setup time of 2.5 ns
  • Single pass logic expandable to 48 product terms
  • High-speed pin-to-pin delays of 5.0 ns
  • Slew rate control per output
  • 100% routable
  • Security bit prevents unauthorized access
  • Supports hot-plugging capability
  • Design entry/verification using Xilinx or industry standard CAE tools
  • Innovative Control Term structure provides:
    • Asynchronous macrocell clocking
    • Asynchronous macrocell register preset/reset
    • Clock enable control per macrocell
  • Four output enable controls per function block
  • Foldback NAND for synthesis optimization
  • Universal 3-state which facilitates "bed of nails" testing
  • Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.

Product Attributes

TYPE DESCRIPTION Select all
Package / Case 324-BBGA
Programmable Not Verified
Supplier Device Package 324-FBGA (23x23)
Programmable Type In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max 9 ns
Voltage Supply - Internal 2.7V ~ 3.6V
Number of Logic Elements/Blocks 24
Number of Macrocells 384
Number of Gates 9000
Number of I/O 220
Series CoolRunner XPLA3
Operating Temperature -40°C ~ 85°C (TA)
Package Tray
Mounting Type Surface Mount
Product Status Obsolete

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Price negotiable

Price update:a months ago
Available in stock: 2481
AMD

AMD

AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).

View All Product from AMD

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