XCR3384XL-10FG324I datasheet
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XCR3384XL-10FG324I AMD
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
View All Product from AMDThe CoolRunner XPLA3 (eXtended Programmable Logic Array) family of CPLDs is targeted for low power systems that include portable, handheld, and power sensitive applications. Each member of the CoolRunner XPLA3 family includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the CoolRunner XPLA3 family offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for "turbo bits" or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. CoolRunner devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.
The CoolRunner XPLA3 family employs a full PLA structure for logic allocation within a function block. The PLA provides maximum flexibility and logic density, with superior pin locking capability, while maintaining deterministic timing.
CoolRunner XPLA3 CPLDs are supported by Xilinx® WebPACK™ software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.
The CoolRunner XPLA3 family features also include the industry-standard, IEEE 1149.1, JTAG interface through which boundary-scan testing, In-System Programming (ISP), and reprogramming of the device can occur. The CoolRunner XPLA3 CPLD is electrically reprogrammable using industry standard device programmers.
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Mfr Part # | Price ($) | Quantity Available | |
---|---|---|---|
XCR3256XL-12TQ144CIC CPLD 256MC 10.8NS 144TQFP | 55.32 |
12
Marketplace | |
XCR3256XL-12FT256IIC CPLD 256MC 10.8NS 256FTBGA | 20.75 |
320
Marketplace | |
XCR3256XL-7PQ208CIC CPLD 256MC 7NS 208QFP | 62.24 |
3343
Marketplace | |
XCR3256XL-12TQG144IIC CPLD 256MC 10.8NS 144TQFP | 56.70 |
500
Marketplace | |
XCR3256XL-12PQ208CIC CPLD 256MC 10.8NS 208QFP | 414.90 |
298
Marketplace |
IC CPLD 256MC 10.8NS 144TQFP
IC CPLD 256MC 10.8NS 256FTBGA
IC CPLD 256MC 7NS 208QFP
IC CPLD 256MC 10.8NS 144TQFP
IC CPLD 256MC 10.8NS 208QFP
TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | 324-BBGA | |
Programmable | Not Verified | |
Supplier Device Package | 324-FBGA (23x23) | |
Programmable Type | In System Programmable (min 1K program/erase cycles) | |
Delay Time tpd(1) Max | 9 ns | |
Voltage Supply - Internal | 2.7V ~ 3.6V | |
Number of Logic Elements/Blocks | 24 | |
Number of Macrocells | 384 | |
Number of Gates | 9000 | |
Number of I/O | 220 | |
Series | CoolRunner XPLA3 | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Package | Tray | |
Mounting Type | Surface Mount | |
Product Status | Obsolete |
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
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