XCR3256XL-12TQG144I datasheet
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XCR3256XL-12TQG144I Xilinx
Xilinx
Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).
View All Product from XilinxIntroduction
The Spartan@-ll Field-Programmable Gate Array family gives users high performance, abundant logic resources, and a rich feature set, all at an exceptionally low price. The six-member family offers densities ranging from 15,000 to 200,000 system gates, as shown in Table 1. System performance is supported up to 200 MHz. Features includeblock RAM(to 56K bits), distributed RAM(to 75,264 bits), 16 selectable I/O standards, and four DLLs. Fast, predictable interconnect means that successive design iterations continue to meet timing requirements.
The Spartan-lI family is a superior alternative to mask-programmed ASICs. The FPGA avoids the initial cost, lengthy development cycles, and inherent risk ofconventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary(impossible with ASICs).
Features
· Second generation ASIC replacement technology
-Densities as high as 5,292 logic cells with up to 200,000 system gates
-Streamlined features based on Virtex? FPGA architecture
-Unlimited reprogrammability
-Very low cost
-Cost-effective 0.18 micron process
· System level features
-SelectRAM TM hierarchical memory: 16bits/LUT distributed RAM Configurable 4K bit block RAM
· Fast interfaces to external RAM
-Fully PCI compliant
-Low-power segmented routing architecture
-Full readback ability for verification/observability
-Dedicated carry logic for high-speed arithmetic
-Efficient multiplier support
-Cascade chain for wide-input functions
-Abundant registers/latches with enable, set, reset
-Four dedicated DLLs for advanced clock control
-Four primary low-skew global clock distribution nets
-IEEE 1149.1 compatible boundary scan logic
·Versatile I/O and packaging
-Pb-free package options
-Low-cost packages available in all densities
-Family footprint compatibility in common packages
-16high-performance interface standards
-Hot swap Compact PCI friendly
-Zero hold time simplifies system timing
·Core logic powered at 2.5V and I/Os powered at 1.5V,2.5V,or 3.3V
·Fully supported by powerful XilinxISEdevelopment system
-Fully automatic mapping,placement,and routing
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Mfr Part # | Price ($) | Quantity Available | |
---|---|---|---|
XCR3256XL-12FTG256CIC CPLD 256MC 10.8NS 256FTBGA | 68.90 |
17
Marketplace | |
XCR3256XL-12PQ208CIC CPLD 256MC 10.8NS 208QFP | 413.40 |
298
Marketplace | |
XCR3256XL-12TQ144CIC CPLD 256MC 10.8NS 144TQFP | 55.12 |
12
Marketplace | |
XCR3256XL-10TQG144IIC CPLD 256MC 9.1NS 144TQFP | 41.34 |
3082
Marketplace | |
XCR3256XL-12FT256IIC CPLD 256MC 10.8NS 256FTBGA | 20.67 |
320
Marketplace |
IC CPLD 256MC 10.8NS 256FTBGA
IC CPLD 256MC 10.8NS 208QFP
IC CPLD 256MC 10.8NS 144TQFP
IC CPLD 256MC 9.1NS 144TQFP
IC CPLD 256MC 10.8NS 256FTBGA
TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | 144-LQFP | |
Programmable | Not Verified | |
Supplier Device Package | 144-TQFP (20x20) | |
Programmable Type | In System Programmable (min 1K program/erase cycles) | |
Delay Time tpd(1) Max | 10.8 ns | |
Voltage Supply - Internal | 2.7V ~ 3.6V | |
Number of Logic Elements/Blocks | 16 | |
Number of Macrocells | 256 | |
Number of Gates | 6000 | |
Number of I/O | 120 | |
Series | CoolRunner XPLA3 | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Package | Tray | |
Mounting Type | Surface Mount | |
Product Status | Active |
Xilinx
Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).
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