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XCVM1302-2MSINSVF1369 AMD
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
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The 369HX is XFRMR LAMINATED 120VA CHAS MOUNT, that includes 300 Series, they are designed to operate with a Power Transformers Product, Type is shown on datasheet note for use in a Laminated Core, that offers Packaging features such as Tube, Unit Weight is designed to work in 2.300 lbs, as well as the Mounting Foot Mounting Style, the device can also be used as Wire Leads Termination Style. In addition, the Height is 3.796 in, the device is offered in 3.125 in Length, the device has a 3.5 in of Width, and Mounting Type is Chassis Mount, and the Size Dimension is 88.90mm L x 79.50mm W, and Current Output Max is 150mA, 6A, 3A, and the Power Max is 120 VA, and Voltage Isolation is 2000Vrms, and the Height Seated Max is 96.52mm, and Voltage Primary is 100V, 110V, 120V, 200V, 220V, 240V, and the Voltage Secondary Full Load is 450V, 6.3V, 5V, and Primary Winding s is Dual, Multiple Taps, and the Secondary Winding s is Four, and Center Tap is Yes.
The 369GXP is XFRMR LAMINATED 50VA CHAS MOUNT, that includes 450V, 6.3V Voltage Secondary Full Load, they are designed to operate with a 100V, 110V, 120V, 200V, 220V, 240V Voltage Primary, Voltage Isolation is shown on datasheet note for use in a 2000Vrms, that offers Type features such as Laminated Core, Termination Style is designed to work in Wire Leads, as well as the 69.85mm L x 63.50mm W Size Dimension, the device can also be used as 300 Series. In addition, the Secondary Winding s is Triple, the device is offered in Dual, Multiple Taps Primary Winding s, the device has a 50 VA of Power Max, and Mounting Type is Chassis Mount, and the Height Seated Max is 77.72mm, and Current Output Max is 74mA, 2.5A, and the Center Tap is Yes.
The 369EX is XFRMR LAMINATED 45VA CHAS MOUNT, that includes Yes Center Tap, they are designed to operate with a 75mA, 2.5A Current Output Max, Height Seated Max is shown on datasheet note for use in a 77.72mm, that offers Mounting Type features such as Chassis Mount, Power Max is designed to work in 45 VA, as well as the Dual, Multiple Taps Primary Winding s, the device can also be used as Dual Secondary Winding s. In addition, the Series is 300, the device is offered in 63.50mm L x 69.85mm W Size Dimension, the device has a Wire Leads of Termination Style, and Type is Laminated Core, and the Voltage Isolation is 2000Vrms, and Voltage Primary is 100V, 110V, 120V, 200V, 220V, 240V, and the Voltage Secondary Full Load is 380V, 6.3V.
The 369GX is XFRMR LAMINATED 50VA CHAS MOUNT, that includes Yes Center Tap, they are designed to operate with a Wire Leads Termination Style, Type is shown on datasheet note for use in a Laminated Core, that offers Primary Winding s features such as Dual, Multiple Taps, Secondary Winding s is designed to work in Dual, as well as the Chassis Mount Mounting Type, the device can also be used as 77.72mm Height Seated Max. In addition, the Current Output Max is 75mA, 2.5A, the device is offered in 63.50mm L x 69.85mm W Size Dimension, the device has a 50 VA of Power Max, and Voltage Secondary Full Load is 450V, 6.3V, and the Series is 300, and Voltage Isolation is 2000Vrms, and the Voltage Primary is 100V, 110V, 120V, 200V, 220V, 240V.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | |
Peripherals | DDR, DMA, PCIe | |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Speed | 600MHz, 1.4GHz | |
Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells | |
Series | Versal™ Prime | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package | Tray | |
Package / Case | 1369-BFBGA | |
Product Status | Active | |
Supplier Device Package | 1369-BGA (35x35) | |
Architecture | MPU, FPGA |
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
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