LFCPNX-100-9LFG672I

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1000170001 with pin details, that includes Black Color, they are designed to operate with a Omnimate BL Series, Type is shown on datasheet note for use in a Plug, Female Sockets, that offers Packaging features such as Bulk, Termination Style is designed to work in Screwless - Leg Spring, Push-In Spring, it has an Operating Temperature range of -50°C ~ 100°C, the device can also be used as Free Hanging (In-Line) Mounting Type. In addition, the Features is Retention Latches (Wire Side), the device is offered in 16 Number of Positions, the device has a 0.200" (5.08mm) of Pitch, and Wire Gauge or Range AWG is 12-26 AWG, and the Wire Gauge or Range mm2 is 0.2-2.5mm2, and Current IEC is 24A, and the Voltage IEC is 400V, and Current UL is 18.5A, and the Voltage UL is 300V, and Number of Levels is 1, and the Positions Per Level is 16, and Plug Wire Entry is 90°, and the Contact Mating Finish is Tin.

100-016-001 with user guide, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 100, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -65°C ~ 125°C. In addition, the Number of Positions or Pins Grid is 16 (2 x 8), the device is offered in Through Hole Mounting Type, the device has a Polyphenylene Sulfide (PPS), Glass Filled of Housing Material, and Features is Closed Frame, Seal Tape, and the Contact Material Post is Brass, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is Flash, and Contact Finish Thickness Mating is 8μin (0.20μm), and the Contact Finish Post is Gold, and Contact Finish Mating is Gold.

The 100-016-051 is CONN IC DIP SOCKET 16POS GOLD, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 8μin (0.20μm), that offers Contact Finish Thickness Post features such as Flash, Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Closed Frame, Seal Tape Features. In addition, the Housing Material is Polyphenylene Sulfide (PPS), Glass Filled, the device is offered in Through Hole Mounting Type, the device has a 16 (2 x 8) of Number of Positions or Pins Grid, it has an Operating Temperature range of -65°C ~ 125°C, and the Packaging is Bulk, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 100, and the Termination is Solder, and Type is DIP, 0.3" (7.62mm) Row Spacing.

100-016-050 with EDA / CAD Models, that includes Through Hole Mounting Type, they are designed to operate with a Solder Termination, Housing Material is shown on datasheet note for use in a Polyphenylene Sulfide (PPS), Glass Filled, that offers Features features such as Open Frame, Contact Finish Mating is designed to work in Gold, as well as the Gold Contact Finish Post, the device can also be used as Flash Contact Finish Thickness Post. In addition, the Type is DIP, 0.3" (7.62mm) Row Spacing, the device is offered in Bulk Packaging, the device has a Brass of Contact Material Post, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Mating is 8μin (0.20μm), it has an Operating Temperature range of -65°C ~ 125°C, and the Number of Positions or Pins Grid is 16 (2 x 8), and Series is 100, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).