LFSCM3GA25EP1-6FFAN1020C

LFSCM3GA25EP1-6FFAN1020C

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LFSCM3GA25EP1-6FFAN1020C
IC FPGA 476 I/O 1020BGA
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Price negotiable

Price update:a months ago
Available in stock: 2422
45
Serves customers in 45 countries
1000+
Worldwide Manufacturers
$140M
$140M Growth in 5 Years
50.0M+
50M Parts Shipped in 5 Years
Lattice Semiconductor Corporation

Lattice Semiconductor Corporation

Lattice Semiconductor leads in low-power programmability, solving complex challenges across networks, from Edge to Cloud. With a foothold in communication, computing, industry, autos, and consumers, they nurture lasting relationships, offering world-class support for unfettered innovation, crafting a secure, connected world.

View All Product from Lattice Semiconductor Corporation
The LatticeSC family of FPGAs combines a high-performance FPGA fabric, high-speed SERDES, high-performance I/Os and large embedded RAM in a single industry leading architecture. This FPGA family is fabricated in a state of the art technology to provide one of the highest performing FPGAs in the industry. This family of devices includes features to meet the needs of today���s communication network systems. These features include SERDES with embedded advance PCS (Physical Coding sub-layer), up to 7.8 Mbits of sysMEM embedded block RAM, dedicated logic to support system level standards such as RAPIDIO, SPI4.2, SFI-4, UTOPIA, XGMII and CSIX.

Feature

■ High Performance FPGA Fabric 

• 15K to 115K four input Look-up Tables (LUT4s) 

• 139 to 942 I/Os 

• 700MHz global clock; 1GHz edge clocks 

■ 4 to 32 High Speed SERDES and flexiPCS™ (per Device) 

• Performance ranging from 600Mbps to 3.8Gbps 

• Excellent Rx jitter tolerance (0.8UI at 3.125Gbps) 

• Low Tx jitter (0.25UI typical at 3.125Gbps) 

• Built-in Pre-emphasis and equalization 

• Low power (typically 105mW per channel) 

• Embedded Physical Coding Sublayer (PCS) provides pre-engineered implementation for the following standards: 

– GbE, XAUI, PCI Express, SONET, Serial RapidIO, 1G Fibre Channel, 2G Fibre Channel

■ 2Gbps High Performance PURESPEED™ I/O 

• Supports the following performance bandwidths 

– Differential I/O up to 2Gbps DDR (1GHz Clock) 

– Single-ended memory interfaces up to 800Mbps 

• 144 Tap programmable Input Delay (INDEL) block on every I/O dynamically aligns data to clock for robust performance 

– Dynamic bit Adaptive Input Logic (AIL) monitoring and control circuitry per pin that automatically ensures proper set-up and hold 

– Dynamic bus: uses control bus from DLL 

– Static per bit 

• Electrical standards supported: 

– LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL 

– SSTL 3/2/18 I, II; HSTL 18/15 I, II 

– PCI, PCI-X 

– LVDS, Mini-LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS, Hypertransport 

• Programmable On Die Termination (ODT) 

– Includes Thevenin Equivalent and low power VTT termination options

■ sysCLOCK™ Network 

• Eight analog PLLs per device 

– Frequency range from 15MHz to 1GHz 

– Spread spectrum support 

• 12 DLLs per device with direct control of I/O delay 

– Frequency range from 100MHz to 700MHz 

• Extensive clocking network 

– 700MHz primary and 325 MHz secondary clocks 

– 1GHz I/O-connected edge clocks 

• Precision Clock Divider 

– Phase matched x2 and x4 division of incoming clocks 

• Dynamic Clock Select (DCS) 

– Glitch free clock MUX 

■ Masked Array for Cost Optimization (MACO™) Blocks 

• On-chip structured ASIC Blocks provide preengineered IP for low power, low cost system level integration 

■ High Performance System Bus 

• Ties FPGA elements together with a standard bus framework 

– Connects to peripheral user interfaces for run-time dynamic configuration 

■ System Level Support 

• IEEE standard 1149.1 Boundary Scan, plus ispTRACY™ internal logic analyzer 

• IEEE Standard 1532 in-system configuration 

• 1.2V and 1.0V operation 

• Onboard oscillator for initialization and general use 

• Embedded PowerPC microprocessor interface 

• Low cost wire-bond and high pin count flip-chip packaging 

• Low cost SPI Flash RAM configuration

Product Attributes

TYPE DESCRIPTION Select all
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Series SCM
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Package / Case 1020-BBGA, FCBGA
Product Status Obsolete
Supplier Device Package 1020-OFcBGA Rev 2 (33x33)
Programmable Not Verified
Number of LABs/CLBs 6250
Number of Logic Elements/Cells 25000
Total RAM Bits 1966080
Number of I/O 476

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Price negotiable

Price update:a months ago
Available in stock: 2422
Lattice Semiconductor Corporation

Lattice Semiconductor Corporation

Lattice Semiconductor leads in low-power programmability, solving complex challenges across networks, from Edge to Cloud. With a foothold in communication, computing, industry, autos, and consumers, they nurture lasting relationships, offering world-class support for unfettered innovation, crafting a secure, connected world.

View All Product from Lattice Semiconductor Corporation

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