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1N4761AP/TR12 Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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The 1N4761A-TP is DIODE ZENER 75V 1W DO41G, that includes 1N476 Series, they are designed to operate with a Cut Tape (CT) Alternate Packaging Packaging, Mounting Style is shown on datasheet note for use in a Through Hole, that offers Height features such as 2.8 mm, Length is designed to work in 4.5 mm, as well as the 2.8 mm Width, the device can also be used as DO-204AL, DO-41, Axial Package Case, it has an Operating Temperature range of -65°C ~ 200°C, the device is offered in Through Hole Mounting Type, the device has a DO-41G of Supplier Device Package, and Configuration is Single, and the Tolerance is ±5%, and Power Max is 1W, and the Voltage Zener Nom Vz is 75V, and Impedance Max Zzt is 175 Ohm, and the Current Reverse Leakage Vr is 5μA @ 56V, and Voltage Forward Vf Max If is 1.2V @ 200mA, and the Pd Power Dissipation is 1 W, it has an Maximum Operating Temperature range of + 200 C, it has an Minimum Operating Temperature range of - 65 C, and Vf Forward Voltage is 1.2 V at 200 mA, and the Vz Zener Voltage is 75 V, and Voltage Tolerance is 5 %, and the Zener Current is 12 mA, and Zz Zener Impedance is 175 Ohms, and the Ir Reverse Current is 5 uA.
The 1N4761A-TAP is DIODE ZENER 75V 1.3W DO41, that includes 175 Ohms Zz Zener Impedance, they are designed to operate with a 12 mA Zener Current, Width is shown on datasheet note for use in a 2.6 mm, that offers Vz Zener Voltage features such as 75 V, Voltage Zener Nom Vz is designed to work in 75V, as well as the 5 % Voltage Tolerance, the device can also be used as 1.2V @ 200mA Voltage Forward Vf Max If. In addition, the Unit Weight is 0.010935 oz, the device is offered in ±5% Tolerance, the device has a DO-41 of Supplier Device Package, and Series is Automotive, AEC-Q101, and the Power Max is 1.3W, and Pd Power Dissipation is 1.3 W, and the Packaging is Tape & Box (TB), and Package Case is DO-204AL, DO-41, Axial, it has an Operating Temperature range of 175°C, and Mounting Style is Through Hole, and the Mounting Type is Through Hole, it has an Minimum Operating Temperature range of - 65 C, it has an Maximum Operating Temperature range of + 175 C, and Length is 4.1 mm, and the Ir Reverse Current is 5 uA, and Impedance Max Zzt is 175 Ohm, and the Height is 2.6 mm, and Current Reverse Leakage Vr is 5μA @ 56V, and the Configuration is Single.
1N4761ATA with circuit diagram, that includes 5μA @ 56V Current Reverse Leakage Vr, they are designed to operate with a 175 Ohm Impedance Max Zzt, Mounting Type is shown on datasheet note for use in a Through Hole, it has an Operating Temperature range of 200°C, Package Case is designed to work in DO-204AL, DO-41, Axial, as well as the Tape & Reel (TR) Packaging, the device can also be used as 1W Power Max. In addition, the Supplier Device Package is DO-41, the device is offered in ±5% Tolerance, the device has a 1.2V @ 200mA of Voltage Forward Vf Max If, and Voltage Zener Nom Vz is 75V.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Package | Tape & Reel (TR) | |
Product Status | Obsolete | |
Voltage - Zener (Nom) (Vz) | 75 V | |
Tolerance | ±5% | |
Power - Max | 1 W | |
Impedance (Max) (Zzt) | 175 Ohms | |
Current - Reverse Leakage @ Vr | 5 µA @ 56 V | |
Voltage - Forward (Vf) (Max) @ If | 1.2 V @ 200 mA | |
Operating Temperature | -65°C ~ 150°C | |
Mounting Type | Through Hole | |
Package / Case | DO-204AL, DO-41, Axial | |
Supplier Device Package | DO-204AL (DO-41) |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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