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APTM120H57FT3G Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
View All Product from Microsemi CorporationHey there! If you're on the hunt for some Microsemi Corporation parts like the APTM120H57FT3G, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the APTM120H57FT3G, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The APTM120H29FG is MOSFET 4N-CH 1200V 34A SP6, that includes POWER MOS 7R Series, they are designed to operate with a Bulk Packaging, Package Case is shown on datasheet note for use in a SP6, it has an Operating Temperature range of -40°C ~ 150°C (TJ), Mounting Type is designed to work in Chassis Mount, as well as the SP6 Supplier Device Package, the device can also be used as 4 N-Channel (H-Bridge) FET Type. In addition, the Power Max is 780W, the device is offered in 1200V (1.2kV) Drain to Source Voltage Vdss, the device has a 10300pF @ 25V of Input Capacitance Ciss Vds, and FET Feature is Standard, and the Current Continuous Drain Id 25°C is 34A, and Rds On Max Id Vgs is 348 mOhm @ 17A, 10V, and the Vgs th Max Id is 5V @ 5mA, and Gate Charge Qg Vgs is 374nC @ 10V.
The APTM120H140FT1G is MOSFET 4N-CH 1200V 8A SP1, that includes 5V @ 1mA Vgs th Max Id, they are designed to operate with a SP1 Supplier Device Package, Rds On Max Id Vgs is shown on datasheet note for use in a 1.68 Ohm @ 7A, 10V, that offers Power Max features such as 208W, Packaging is designed to work in Bulk, as well as the SP1 Package Case, it has an Operating Temperature range of -40°C ~ 150°C (TJ). In addition, the Mounting Type is Chassis Mount, the device is offered in 3812pF @ 25V Input Capacitance Ciss Vds, the device has a 145nC @ 10V of Gate Charge Qg Vgs, and FET Type is 4 N-Channel (H-Bridge), and the FET Feature is Standard, and Drain to Source Voltage Vdss is 1200V (1.2kV), and the Current Continuous Drain Id 25°C is 8A.
APTM120DU29TG with circuit diagram, that includes 34A Current Continuous Drain Id 25°C, they are designed to operate with a 1200V (1.2kV) Drain to Source Voltage Vdss, FET Feature is shown on datasheet note for use in a Standard, that offers FET Type features such as 2 N-Channel (Dual), Gate Charge Qg Vgs is designed to work in 374nC @ 10V, as well as the 10300pF @ 25V Input Capacitance Ciss Vds, the device can also be used as Chassis Mount Mounting Type, it has an Operating Temperature range of -40°C ~ 150°C (TJ), the device is offered in SP4 Package Case, the device has a Bulk of Packaging, and Power Max is 780W, and the Rds On Max Id Vgs is 348 mOhm @ 17A, 10V, and Supplier Device Package is SP4, and the Vgs th Max Id is 5V @ 5mA.
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IGBT MODULE 1700V 150A 560W SP4
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IGBT MODULE 600V 400A 935W SP6
IGBT MODULE 1200V 100A 500W SP4
IGBT MODULE 1200V 610A 2307W SP6
MOSFET 2N-CH 100V 495A SP6
TYPE | DESCRIPTION | Select all |
---|---|---|
Package | Bulk | |
Product Status | Obsolete | |
Technology | MOSFET (Metal Oxide) | |
Configuration | 4 N-Channel (Half Bridge) | |
Drain to Source Voltage (Vdss) | 1200V (1.2kV) | |
Current - Continuous Drain (Id) @ 25°C | 17A | |
Rds On (Max) @ Id, Vgs | 684mOhm @ 8.5A, 10V | |
Vgs(th) (Max) @ Id | 5V @ 2.5mA | |
Gate Charge (Qg) (Max) @ Vgs | 187nC @ 10V | |
Input Capacitance (Ciss) (Max) @ Vds | 5155pF @ 25V | |
Power - Max | 390W | |
Operating Temperature | -40°C ~ 150°C (TJ) | |
Mounting Type | Chassis Mount | |
Package / Case | SP3 | |
Supplier Device Package | SP3 |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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