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XCVU23P-2VSVA1365I AMD
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
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The 163A13639X is CONN D-SUB PLUG 9POS VERT SOLDER, that includes 163A Series, they are designed to operate with a Plug Type, Packaging is shown on datasheet note for use in a Bulk, that offers Mounting Style features such as Flange, Termination Style is designed to work in Through Hole, as well as the Solder Termination, the device can also be used as Through Hole Mounting Type. In addition, the Features is Grounding Indents, the device is offered in IP20 Ingress Protection, the device has a Plug, Male Pins of Connector Type, and Contact Material is Copper Alloy, and the Contact Finish is Gold, and Shell Size is 2 (A), and the Shell Plating is Tin, and Number of Positions is 9, and the Pitch is 2.74 mm, and Number of Rows is 2, and the Connector Style is D-Sub, and Gender is Pin, and the Contact Type is Signal, and Flange Feature is Board Side (4-40), and the Shell Material Finish is Steel, Tin Plated, and Shell Size Connector Layout is 1 (DE, E), and the Contact Plating is Gold, and Mounting Angle is Vertical, and the Contact Gender is Pin (Male), and Insulation Material is Polybutylene Terephthalate Glass Filled, and the Shell Material is Steel, and Filtered is Not Filtered, and the Boardlocks is Without Boardlocks.
The 163A13649X is CONN DSUB 25POS M PC TIN GI, that includes Plug Type, they are designed to operate with a Through Hole Termination Style, Shell Size is shown on datasheet note for use in a 3 (B), that offers Shell Plating features such as Tin, Shell Material is designed to work in Steel, as well as the 2.74 mm Pitch, the device can also be used as Tray Packaging. In addition, the Number of Rows is 2 Row, the device is offered in 25 Position Number of Positions, the device has a Flange of Mounting Style, and Mounting Angle is Vertical, and the Insulation Material is Polybutylene Terephthalate Glass Filled, and Gender is Pin, and the Filtered is Not Filtered, and Contact Plating is Gold, and the Contact Material is Copper Alloy, and Contact Gender is Pin (Male), and the Boardlocks is Without Boardlocks.
The 163A13629X is CONN DSUB 9POS M PC TIN GI, that includes Without Boardlocks Boardlocks, they are designed to operate with a Pin (Male) Contact Gender, Contact Material is shown on datasheet note for use in a Copper Alloy, that offers Contact Plating features such as Gold, Filtered is designed to work in Not Filtered, as well as the Pin Gender, the device can also be used as Polybutylene Terephthalate Glass Filled Insulation Material. In addition, the Mounting Angle is Vertical, the device is offered in Flange Mounting Style, the device has a 9 Position of Number of Positions, and Number of Rows is 2 Row, and the Pitch is 2.74 mm, and Shell Material is Steel, and the Shell Plating is Tin, and Shell Size is 1 (E), and the Termination Style is Through Hole, and Type is Plug.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Voltage - Supply | 0.825V ~ 0.876V | |
Mounting Type | Surface Mount | |
Series | Virtex® UltraScale+™ | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package | Tray | |
Package / Case | 1365-BFBGA, FCBGA | |
Product Status | Active | |
Supplier Device Package | 1365-FCBGA (35x35) | |
Programmable | Not Verified | |
Number of LABs/CLBs | 128700 | |
Number of Logic Elements/Cells | 2252250 | |
Total RAM Bits | 77909197 | |
Number of I/O | 364 |
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
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