XCZU5EV-2FBVB900E datasheet
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XCZU5EV-2FBVB900E AMD
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
View All Product from AMDThe Xilinx® UltraScale™ architecture is the first ASIC-class All Programmable architecture to enable multi-hundred gigabit-per-second levels of system performance with smart processing, while efficiently routing and processing data on-chip. UltraScale architecture-based devices address a vast spectrum of high-bandwidth, high-utilization system requirements by using industry-leading technical innovations, including next-generation routing, ASIC-like clocking, 3D-on-3D ICs, multiprocessor SoC (MPSoC) technologies, and new power reduction features. The devices share many building blocks, providing scalability across process nodes and product families to leverage system-level investment across platforms.
Virtex® UltraScale+™ devices provide the highest performance and integration capabilities in a FinFET node, including both the highest serial I/O and signal processing bandwidth, as well as the highest on-chip memory density. As the industry's most capable FPGA family, the Virtex UltraScale+ devices are ideal for applications including 1+Tb/s networking and data center and fully integrated radar/early-warning systems.
Virtex UltraScale devices provide the greatest performance and integration at 20 nm, including serial I/O bandwidth and logic capacity. As the industry's only high-end FPGA at the 20 nm process node, this family is ideal for applications including 400G networking, large scale ASIC prototyping, and emulation.
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A: Our professional business development department conducts rigorous testing and verification of the qualifications of original manufacturers and agents of . All suppliers must undergo and pass our qualification review before they are allowed to list their XCZU5EV-2FBVB900E devices on our platform. We prioritize the sourcing channels and quality of XCZU5EV-2FBVB900E products above everything else, ensuring thorough supplier audits so you can make your purchase with utmost confidence.
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Mfr Part # | Price ($) | Quantity Available | |
---|---|---|---|
XCZU5EV-1FBVB900IIC SOC CORTEX-A53 900FCBGA | 3455.21 |
140
Marketplace | |
XCZU5EG-1SFVC784IIC SOC CORTEX-A53 784FCBGA | 826.80 |
170
Marketplace | |
XCZU5CG-2SFVC784IIC SOC CORTEX-A53 784FCBGA | 1157.52 |
3615
Marketplace | |
XCZU5EV-1SFVC784IIC SOC CORTEX-A53 784FCBGA | 344.50 |
2000
Marketplace | |
XCZU5CG-1SFVC784IIC SOC CORTEX-A53 784FCBGA | 1212.64 |
2026
Marketplace | |
XCZU5EV-1SFVC784EIC SOC CORTEX-A53 784FCBGA | 206.70 |
2939
Marketplace |
IC SOC CORTEX-A53 900FCBGA
IC SOC CORTEX-A53 784FCBGA
IC SOC CORTEX-A53 784FCBGA
IC SOC CORTEX-A53 784FCBGA
IC SOC CORTEX-A53 784FCBGA
IC SOC CORTEX-A53 784FCBGA
TYPE | DESCRIPTION | Select all |
---|---|---|
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
RAM Size | 256KB | |
Peripherals | DMA, WDT | |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Speed | 533MHz, 600MHz, 1.3GHz | |
Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |
Series | Zynq® UltraScale+™ MPSoC EV | |
Operating Temperature | 0°C ~ 100°C (TJ) | |
Package | Tray | |
Package / Case | 900-BBGA, FCBGA | |
Product Status | Active | |
Supplier Device Package | 900-FCBGA (31x31) | |
Architecture | MCU, FPGA |
AMD
AMD stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System-on-Chips (SoCs), Multiprocessor SoCs (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). Notably, AMD confers singular prowess in facilitating software-defined and hardware-optimized applications, thus propelling progress across domains like Cloud Computing, 5G Wireless, Embedded Vision, and Industrial Internet of Things (IoT).
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