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1SG085HN3F43I1VG Intel
Intel
Intel empowers electronic system designers for swift, economical innovation, distinctiveness, and triumph in their sectors. Intel proffers FPGAs, SoCs, CPLDs, and Power Solutions, delivering elevated-value resolutions globally.
View All Product from IntelHey there! If you're on the hunt for some Intel parts like the 1SG085HN3F43I1VG, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the 1SG085HN3F43I1VG, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The 5-104196-2 is CONN RCPT 10POS R/A T/H GOLD, that includes Black Color, they are designed to operate with a AMPMODU System 50 Series, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, Right Angle, as well as the Board Guide Features, the device can also be used as Receptacle Connector Type. In addition, the Contact Finish is Gold, the device is offered in 30μin (0.76μm) Contact Finish Thickness, the device has a 10 of Number of Positions, and Number of Positions Loaded is All, and the Pitch is 0.050" (1.27mm), and Number of Rows is 1, and the Contact Type is Male Pin.
The 5-104196-5 is CONN RCPT 20POS R/A T/H GOLD, that includes Solder Termination, they are designed to operate with a AMPMODU System 50 Series, Pitch is shown on datasheet note for use in a 0.050" (1.27mm), that offers Packaging features such as Tube, Number of Rows is designed to work in 1, as well as the All Number of Positions Loaded, the device can also be used as 20 Number of Positions. In addition, the Mounting Type is Through Hole, Right Angle, the device is offered in Board Guide Features, the device has a Male Pin of Contact Type, and Contact Finish Thickness is 30μin (0.76μm), and the Contact Finish is Gold, and Connector Type is Receptacle, and the Color is Black.
The 5-104192-4 is CONN RCPT 15POS GOLD T/H, that includes Black Color, they are designed to operate with a Receptacle Connector Type, Contact Finish is shown on datasheet note for use in a Gold, that offers Contact Finish Thickness features such as 30μin (0.76μm), Contact Type is designed to work in Female Socket, as well as the Through Hole Mounting Type, the device can also be used as 15 Number of Positions. In addition, the Number of Positions Loaded is All, the device is offered in 1 Number of Rows, the device has a Tube of Packaging, and Pitch is 0.050" (1.27mm), and the Series is AMPMODU System 50, and Termination is Solder.
51-042.0 with EDA / CAD Models, that includes Series 51 Series.
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A: Our professional business development department conducts rigorous testing and verification of the qualifications of original manufacturers and agents of . All suppliers must undergo and pass our qualification review before they are allowed to list their 1SG085HN3F43I1VG devices on our platform. We prioritize the sourcing channels and quality of 1SG085HN3F43I1VG products above everything else, ensuring thorough supplier audits so you can make your purchase with utmost confidence.
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A: We conduct a Pre-Shipment Inspection (PSI) on randomly selected batches from your order to ensure quality before shipment. We will accept returns or replacements of the 1SG085HN3F43I1VG if it does not meet your expectations under the following conditions:
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TYPE | DESCRIPTION | Select all |
---|---|---|
Voltage - Supply | 0.77V ~ 0.97V | |
Mounting Type | Surface Mount | |
Series | Stratix® 10 GX | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package | Tray | |
Package / Case | 1760-BBGA, FCBGA | |
Product Status | Active | |
Supplier Device Package | 1760-FBGA (42.5x42.5) | |
Programmable | Not Verified | |
Number of LABs/CLBs | 106250 | |
Number of Logic Elements/Cells | 850000 | |
Number of I/O | 688 |
Intel
Intel empowers electronic system designers for swift, economical innovation, distinctiveness, and triumph in their sectors. Intel proffers FPGAs, SoCs, CPLDs, and Power Solutions, delivering elevated-value resolutions globally.
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