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APTGT75SK120D1G Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
View All Product from Microsemi CorporationHey there! If you're on the hunt for some Microsemi Corporation parts like the APTGT75SK120D1G, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the APTGT75SK120D1G, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The APTGT75H60T1G is POWER MOD IGBT FULL BRIDGE SP1, that includes SP1 Package Case, they are designed to operate with a Chassis Mount Mounting Type, Supplier Device Package is shown on datasheet note for use in a SP1, that offers Input features such as Standard, Configuration is designed to work in Full Bridge Inverter, as well as the 250W Power Max, the device can also be used as 100A Current Collector Ic Max. In addition, the Voltage Collector Emitter Breakdown Max is 600V, the device is offered in 250μA Current Collector Cutoff Max, the device has a Trench Field Stop of IGBT Type, and Vce on Max Vge Ic is 1.9V @ 15V, 75A, and the Input Capacitance Cies Vce is 4.62nF @ 25V, and NTC Thermistor is Yes.
The APTGT75H60T2G is POWER MOD IGBT3 FULL BRIDGE SP2, that includes 600V Voltage Collector Emitter Breakdown Max, they are designed to operate with a 1.9V @ 15V, 75A Vce on Max Vge Ic, Supplier Device Package is shown on datasheet note for use in a SP2, that offers Power Max features such as 250W, Package Case is designed to work in SP2, as well as the Yes NTC Thermistor, the device can also be used as Chassis Mount Mounting Type. In addition, the Input Capacitance Cies Vce is 4.62nF @ 25V, the device is offered in Standard Input, the device has a Trench Field Stop of IGBT Type, and Current Collector Ic Max is 100A, and the Current Collector Cutoff Max is 250μA, and Configuration is Full Bridge Inverter.
APTGT75H60T3G with circuit diagram, that includes Full Bridge Inverter Configuration, they are designed to operate with a 250μA Current Collector Cutoff Max, Current Collector Ic Max is shown on datasheet note for use in a 100A, that offers IGBT Type features such as Trench Field Stop, Input is designed to work in Standard, as well as the 4.62nF @ 25V Input Capacitance Cies Vce, the device can also be used as Chassis Mount Mounting Type. In addition, the NTC Thermistor is Yes, the device is offered in SP3 Package Case, the device has a 250W of Power Max, and Supplier Device Package is SP3, and the Vce on Max Vge Ic is 1.9V @ 15V, 75A, and Voltage Collector Emitter Breakdown Max is 600V.
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IGBT MODULE 1700V 150A 560W SP4
IGBT MODULE 600V 430A 1562W SP6
IGBT MODULE 600V 400A 935W SP6
IGBT MODULE 600V 220A 833W SP6
IGBT MODULE 1200V 610A 2307W SP6
IGBT MODULE 1200V 400A 1780W SP6
TYPE | DESCRIPTION | Select all |
---|---|---|
Package | Bulk | |
Product Status | Discontinued at | |
IGBT Type | Trench Field Stop | |
Configuration | Single | |
Voltage - Collector Emitter Breakdown (Max) | 1200 V | |
Current - Collector (Ic) (Max) | 110 A | |
Power - Max | 357 W | |
Vce(on) (Max) @ Vge, Ic | 2.1V @ 15V, 75A | |
Current - Collector Cutoff (Max) | 4 mA | |
Input Capacitance (Cies) @ Vce | 5.345 nF @ 25 V | |
Input | Standard | |
NTC Thermistor | No | |
Operating Temperature | -40°C ~ 150°C (TJ) | |
Mounting Type | Chassis Mount | |
Package / Case | D1 | |
Supplier Device Package | D1 |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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