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HSM8100J/TR13 Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
View All Product from Microsemi CorporationHey there! If you're on the hunt for some Microsemi Corporation parts like the HSM8100J/TR13, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the HSM8100J/TR13, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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HSM8100G/TR13 with pin details, that includes Tape & Reel (TR) Packaging, they are designed to operate with a DO-215AB, SMC Gull Wing Package Case, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Supplier Device Package features such as DO-215AB, Speed is designed to work in Fast Recovery = 200mA (Io), as well as the Schottky Diode Type, the device can also be used as 500μA @ 100V Current Reverse Leakage Vr. In addition, the Voltage Forward Vf Max If is 780mV @ 8A, the device is offered in 100V Voltage DC Reverse Vr Max, the device has a 8A of Current Average Rectified Io, it has an Operating Temperature Junction range of -55°C ~ 175°C.
HSM8100GE3/TR13 with user guide, that includes 780mV @ 8A Voltage Forward Vf Max If, they are designed to operate with a 100V Voltage DC Reverse Vr Max, Supplier Device Package is shown on datasheet note for use in a DO-215AB, that offers Speed features such as Fast Recovery = 200mA (Io), Packaging is designed to work in Tape & Reel (TR), as well as the DO-215AB, SMC Gull Wing Package Case, it has an Operating Temperature Junction range of -55°C ~ 175°C. In addition, the Mounting Type is Surface Mount, the device is offered in Schottky Diode Type, the device has a 500μA @ 100V of Current Reverse Leakage Vr, and Current Average Rectified Io is 8A.
HSM8100J/TR13 with circuit diagram, that includes 8A Current Average Rectified Io, they are designed to operate with a 500μA @ 100V Current Reverse Leakage Vr, Diode Type is shown on datasheet note for use in a Schottky, that offers Mounting Type features such as Surface Mount, it has an Operating Temperature Junction range of -55°C ~ 175°C, as well as the DO-214AB, SMC Package Case, the device can also be used as Tape & Reel (TR) Packaging. In addition, the Speed is Fast Recovery = 200mA (Io), the device is offered in DO-214AB Supplier Device Package, the device has a 100V of Voltage DC Reverse Vr Max, and Voltage Forward Vf Max If is 780mV @ 8A.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | DO-214AB, SMC | |
Mounting Type | Surface Mount | |
Current - Reverse Leakage @ Vr | 500 µA @ 100 V | |
Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
Voltage - Forward (Vf) (Max) @ If | 780 mV @ 8 A | |
Current - Average Rectified (Io) | 8A | |
Voltage - DC Reverse (Vr) (Max) | 100 V | |
Technology | Schottky | |
Operating Temperature - Junction | -55°C ~ 175°C | |
Supplier Device Package | DO-214AB | |
Package | Tape & Reel (TR) | |
Product Status | Active |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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