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JANTX1N6641US Microsemi Corporation
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
View All Product from Microsemi CorporationHey there! If you're on the hunt for some Microsemi Corporation parts like the JANTX1N6641US, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the JANTX1N6641US, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The JANTX1N6638US is DIODE SW 125V 300MA D5D, that includes Military, MIL-PRF-19500/578 & /609 Series, they are designed to operate with a Bulk Packaging, Package Case is shown on datasheet note for use in a SQ-MELF, D, that offers Mounting Type features such as Surface Mount, Supplier Device Package is designed to work in D-5D, as well as the Fast Recovery = 200mA (Io) Speed, the device can also be used as Standard Diode Type. In addition, the Current Reverse Leakage Vr is 100μA @ 125V, the device is offered in 1.1V @ 200mA Voltage Forward Vf Max If, the device has a 125V of Voltage DC Reverse Vr Max, and Current Average Rectified Io is 300mA (DC), and the Reverse Recovery Time trr is 4.5ns, it has an Operating Temperature Junction range of -65°C ~ 175°C.
The JANTX1N6639US is DIODE SWITCHING 300MA D-5D, that includes 1.2V @ 300mA Voltage Forward Vf Max If, they are designed to operate with a 75V Voltage DC Reverse Vr Max, Supplier Device Package is shown on datasheet note for use in a D-5D, that offers Speed features such as Fast Recovery = 200mA (Io), Series is designed to work in Military, MIL-PRF-19500/609, as well as the 4ns Reverse Recovery Time trr, the device can also be used as Bulk Packaging. In addition, the Package Case is SQ-MELF, D, it has an Operating Temperature Junction range of -65°C ~ 175°C, the device has a Surface Mount of Mounting Type, and Diode Type is Standard, and the Current Reverse Leakage Vr is 100nA @ 75V, and Current Average Rectified Io is 300mA (DC).
JANTX1N6639 with circuit diagram, that includes 300mA (DC) Current Average Rectified Io, they are designed to operate with a 100μA @ 75V Current Reverse Leakage Vr, Diode Type is shown on datasheet note for use in a Standard, that offers Mounting Type features such as Through Hole, it has an Operating Temperature Junction range of -65°C ~ 175°C, as well as the D, Axial Package Case, the device can also be used as Bulk Packaging. In addition, the Reverse Recovery Time trr is 4ns, the device is offered in Military, MIL-PRF-19500/609 Series, the device has a Fast Recovery = 200mA (Io) of Speed, and Supplier Device Package is D-5D, and the Voltage DC Reverse Vr Max is 75V, and Voltage Forward Vf Max If is 1.2V @ 300mA.
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Mfr Part # | Price ($) | Quantity Available | |
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JANTX1N6628DIODE GEN PURP 660V 1.75A AXIAL | 14.96 |
2559
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JANTX1N6627DIODE GEN PURP 440V 1.75A AXIAL | 14.51 |
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JANTX1N6306RDIODE GEN PURP 150V 70A DO5 | 11024.00 |
3023
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JANTX1N6306DIODE GEN PURP 150V 70A DO5 | 0.96 |
4839
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JANTX1N6627USDIODE GEN PURP 440V 1.75A D-5B | 15.44 |
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TYPE | DESCRIPTION | Select all |
---|---|---|
Package / Case | SQ-MELF, E | |
Mounting Type | Surface Mount | |
Current - Reverse Leakage @ Vr | 100 µA @ 50 V | |
Reverse Recovery Time (trr) | 5 ns | |
Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 300 mA | |
Current - Average Rectified (Io) | 300mA | |
Voltage - DC Reverse (Vr) (Max) | 50 V | |
Technology | Standard | |
Operating Temperature - Junction | -65°C ~ 175°C | |
Supplier Device Package | D-5B | |
Series | Military, MIL-PRF-19500/609 | |
Package | Bulk | |
Product Status | Active |
Microsemi Corporation
Microsemi, now under Microchip Technology, joined in May 2018. They bring a wide range of tech solutions. These cover aerospace, defense, communication, data centers, and industry needs. Their offerings include strong ICs, FPGAs, SoCs, power management, timing, voice processors, and more, all built for tough conditions. They even have solutions for storage and Power-over-Ethernet setups.
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