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TDZ9V1J,115 NXP USA Inc.
NXP USA Inc.
NXP Semiconductors, a frontrunner in embedded controllers, offers a wide array of MCUs with Arm-based processors. Their innovation extends to robust Power Management for industry and automotive use. NXP's products globally empower and interconnect, fostering proficiency for individuals, organizations, and the world. Noteworthy is the integration of Freescale Semiconductor into NXP (December 2015).
View All Product from NXP USA Inc.Hey there! If you're on the hunt for some NXP USA Inc. parts like the TDZ9V1J,115, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the TDZ9V1J,115, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The TDZ8V2J,115 is DIODE ZENER 8.2V 500MW SOD323F, that includes Tape & Reel (TR) Packaging, they are designed to operate with a SC-90, SOD-323F Package Case, it has an Operating Temperature range of -55°C ~ 150°C, that offers Mounting Type features such as Surface Mount, Supplier Device Package is designed to work in SOD-323F, as well as the ±2% Tolerance, the device can also be used as 500mW Power Max. In addition, the Voltage Zener Nom Vz is 8.2V, the device is offered in 10 Ohm Impedance Max Zzt, the device has a 700nA @ 5V of Current Reverse Leakage Vr, and Voltage Forward Vf Max If is 1.1V @ 100mA.
The TDZ7V5J,115 is DIODE ZENER 7.5V 500MW SOD323F, that includes 7.5V Voltage Zener Nom Vz, they are designed to operate with a 1.1V @ 100mA Voltage Forward Vf Max If, Tolerance is shown on datasheet note for use in a ±2%, that offers Supplier Device Package features such as SOD-323F, Power Max is designed to work in 500mW, as well as the Tape & Reel (TR) Packaging, the device can also be used as SC-90, SOD-323F Package Case, it has an Operating Temperature range of -55°C ~ 150°C, the device is offered in Surface Mount Mounting Type, the device has a 10 Ohm of Impedance Max Zzt, and Current Reverse Leakage Vr is 1μA @ 5V.
TDZ9.1 with circuit diagram manufactured by ROHM. The TDZ9.1 is available in SOD323 Package, is part of the IC Chips.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Series | Automotive, AEC-Q101, TDZxJ | |
Package | Bulk | |
Product Status | Active | |
Voltage - Zener (Nom) (Vz) | 9.1 V | |
Tolerance | ±2% | |
Power - Max | 500 mW | |
Impedance (Max) (Zzt) | 10 Ohms | |
Current - Reverse Leakage @ Vr | 500 nA @ 6 V | |
Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 100 mA | |
Operating Temperature | -55°C ~ 150°C | |
Mounting Type | Surface Mount | |
Package / Case | SC-90, SOD-323F | |
Supplier Device Package | SOD-323F |
NXP USA Inc.
NXP Semiconductors, a frontrunner in embedded controllers, offers a wide array of MCUs with Arm-based processors. Their innovation extends to robust Power Management for industry and automotive use. NXP's products globally empower and interconnect, fostering proficiency for individuals, organizations, and the world. Noteworthy is the integration of Freescale Semiconductor into NXP (December 2015).
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