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TPA701DGN Texas Instruments
Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor powerhouse, crafts advanced analog ICs and embedded processors. Fueled by top-tier minds, TI's innovations drive tech's future, impacting 100,000+ clients.
View All Product from Texas InstrumentsThe TPA701DGN is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701DGN can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701DGN is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Voltage - Supply | 2.5V ~ 5.5V | |
Max Output Power x Channels @ Load | 700mW x 1 @ 8Ohm | |
Output Type | 1-Channel (Mono) | |
Type | Class AB | |
Product Status | Active | |
Package | Tube | |
Package / Case | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad | |
Supplier Device Package | 8-HVSSOP | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Mounting Type | Surface Mount | |
Features | Short-Circuit and Thermal Protection, Shutdown |
Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor powerhouse, crafts advanced analog ICs and embedded processors. Fueled by top-tier minds, TI's innovations drive tech's future, impacting 100,000+ clients.
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