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VNC2-32L1C-TRAY FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity. FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China).
View All Product from FTDI, Future Technology Devices International LtdHey there! If you're on the hunt for some FTDI, Future Technology Devices International Ltd parts like the VNC2-32L1C-TRAY, you’ve come to the right place at szcomponents Electronics. We stock a wide range of electronics from the world’s top brands. Each piece we carry, especially the VNC2-32L1C-TRAY, is not only top-notch but also passes through rigorous checks by our own testing team to ensure it meets all the standards you need.
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The VNC2-32L1B-REEL is IC USB HOST/DEVICE CTRL 32-LQFP, that includes Vinculum-II Series, they are designed to operate with a USB Host Controllers Product, Type is shown on datasheet note for use in a Host Controller, that offers Packaging features such as Digi-ReelR Alternate Packaging, Unit Weight is designed to work in 0.027302 oz, as well as the SMD/SMT Mounting Style, the device can also be used as 32-LQFP Package Case, it has an Operating Temperature range of -40°C ~ 85°C, the device is offered in Controller Function, the device has a SPI, UART of Interface, and Voltage Supply is 1.62 V ~ 1.98 V, and the Supplier Device Package is 32-LQFP (7x7), and Speed is High-Speed, and the Current Supply is 25mA, and Protocol is USB, and the Standards is USB 2.0, and Data Rate is 480 Mb/s, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 1.8 V 3.3 V, and Standard is USB 2.0, and the Operating Supply Current is 25 mA, and Part # Aliases is VINCULUM2.
The VNC2-32L1B-TRAY is IC USB HOST/DEVICE CTRL 32-LQFP, that includes 1.62 V ~ 1.98 V Voltage Supply, they are designed to operate with a 0.027302 oz Unit Weight, Type is shown on datasheet note for use in a Host Controller, that offers Supplier Device Package features such as 32-LQFP (7x7), Standards is designed to work in USB 2.0, as well as the USB 2.0 Standard, the device can also be used as High-Speed Speed. In addition, the Series is Vinculum-II, the device is offered in USB Protocol, the device has a USB Host Controllers of Product, and Part # Aliases is VINCULUM2, and the Packaging is Tray Alternate Packaging, and Package Case is 32-LQFP, it has an Operating Temperature range of -40°C ~ 85°C, and Operating Supply Voltage is 1.8 V 3.3 V, and the Operating Supply Current is 25 mA, and Mounting Style is SMD/SMT, it has an Minimum Operating Temperature range of - 40 C, it has an Maximum Operating Temperature range of + 85 C, and the Interface is SPI, UART, and Function is Controller, and the Data Rate is 480 Mb/s, and Current Supply is 25mA.
The VNC2 DEBUG MODULE is MOD VINCULUM-II DEBUGGR/PROGRAMR, that includes Board Contents, they are designed to operate with a Provide connectivity between the VCN2 IDE development software and debug interface pin on the VNC2 USB host controller device Description Function, Dimensions is shown on datasheet note for use in a 28 mm x 12.8 mm x 6.4 mm, that offers For Use With features such as Vinculum-II IDE development tools, For Use With Related Products is designed to work in VNC2 Devices, as well as the USB Interface Type, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, the device is offered in 5 V Operating Supply Voltage, the device has a Bulk of Packaging, and Product is Evaluation Boards, and the Series is Vinculum-II, and Tool Is For Evaluation Of is Vinculum-II (VNC2) USB host controller, and the Tradename is Vinculum-II, and Type is In-Circuit Debugger/Programmer.
VNC2-32L1B-R with EDA / CAD Models manufactured by FTDI. The VNC2-32L1B-R is available in LQFP-32 Package, is part of the IC Chips.
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TYPE | DESCRIPTION | Select all |
---|---|---|
Product Status | Active | |
Package | Tray | |
Supplier Device Package | 32-LQFP (7x7) | |
Series | Vinculum-II | |
Package / Case | 32-LQFP | |
Operating Temperature | -40°C ~ 85°C | |
Current - Supply | 25mA | |
Voltage - Supply | 3.3V | |
Standards | USB 2.0 | |
Interface | SPI, UART | |
Function | Controller | |
Protocol | USB | |
Programmable | Not Verified |
FTDI, Future Technology Devices International Ltd
FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. Through application of its “Design Made Easy” ethos, the company is able to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts universally recognized products. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip allowing dramatic reductions in the development time and bill-of-materials costs involved in Human Machine Interfaces (HMIs) implementation. FTDI Chip also provides families of highly differentiated, speed-optimised microcontrollers with augmented connectivity. FTDI Chip is a fab-less semiconductor company headquartered in Glasgow, UK, with research and development facilities located in Glasgow, Singapore and Taipei (Taiwan), plus regional sales and technical support sites in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China).
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